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2.0x1.25mm SMD CHIP LED LAMP APTK2012SYC SUPER BRIGHT YELLOW Features 2.0mmx1.25mm SMT LED, 0.75mm THICKNESS. LOW POWER CONSUMPTION. WIDE VIEWING ANGLE. IDEAL FOR BACK LIGHT AND INDICATOR. VARIOUS COLORS AND LENS TYPES AVAILABLE. PACKAGE : 2000PCS / REEL. Description The Super Bright Yellow devices is made with DH InGaAlP (on GaAs substrate) light emitting diode chip. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD1120 APPROVED: J. Lu REV NO: V.2 CHECKED: Allen Liu DATE: FEB/28/2005 DRAWN: W.J.ZHU PAGE: 1 OF 4 ERP:1204000332 Selection Guide Part No. Dice Lens Type Iv (mcd) @ 20mA Min. APTK2012SYC SUPER BRIGHT YELLOW (InGaAlP) WATER CLEAR 50 Typ. 120 Viewing Angle 2 1/2 100 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25C Symbol peak D 1/2 C VF IR Parameter Peak Wavelength Dominant Wavelength Spectral Line Half-width Capacitance Forward Voltage Reverse Current Device Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Typ. 590 588 28 25 2.0 2.5 10 Max. Units nm nm nm pF V uA Test Conditions IF=20mA IF=20mA IF=20mA VF=0V;f=1MHz IF=20mA VR = 5V Absolute Maximum Ratings at TA=25C Parameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Super Bright Yellow 125 30 150 5 -40C To +85C Units mW mA mA V SPEC NO: DSAD1120 APPROVED: J. Lu REV NO: V.2 CHECKED: Allen Liu DATE: FEB/28/2005 DRAWN: W.J.ZHU PAGE: 2 OF 4 ERP:1204000332 Super Bright Yellow APTK2012SYC SPEC NO: DSAD1120 APPROVED: J. Lu REV NO: V.2 CHECKED: Allen Liu DATE: FEB/28/2005 DRAWN: W.J.ZHU PAGE: 3 OF 4 ERP:1204000332 APTK2012MGC APTK2012SYC SMT Reflow Soldering Instructions SMT Reflow Soldering Instructions Number of reflow process shall be 2be less than and cooling cooling Number of reflow process shall times or less 2 times and processto normal temperature is required between first and process to normal temperature is required between first and second soldering process. second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD1120 APPROVED: J. Lu REV NO: V.2 CHECKED: Allen Liu DATE: FEB/28/2005 DRAWN: W.J.ZHU PAGE: 4 OF 4 ERP:1204000332 |
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